Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8 (eBook, PDF)

Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics
Redaktion: Rossi, Marco; Gloeckner, Paul; Backman, David; Dewald, Adrian; Singh, Raman; Connesson, Nathanael; Sasso, Marco

• Format: PDF

Produktbeschreibung

Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the eighth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:

Advances in Residual Stress Measurement Methods

Residual Stress Effects on Material Performance

Optical, Ultrasonic, and Diffraction Methods for Residual Stress Measurement

Thermomechanics & Infrared Imaging

Inverse Methods

Inverse Methods in Plasticity

Applications in Experimental Mechanics

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Produktdetails

• Verlag: Springer International Publishing
• Seitenzahl: 377
• Erscheinungstermin: 27. August 2013
• Englisch
• ISBN-13: 9783319008769
• Artikelnr.: 43787628

Inhaltsangabe

From the Contents: Analysis of Thrust Production in Small Synthetic Flapping Wings.- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian CT Reconstruction. Part I: Discretization and Algorithm.- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian CT Reconstruction. Part II: Hardware Design and Demonstration.- Crack Nucleation Threshold Under Fretting Loading by a Thermal Method.- Crack Growth Study of Fibre Metal Laminates Using Thermoelastic Stress Analysis.- Crack Detection in Large Welded Components Under Fatigue Using TSA.- Hybrid Thermoelastic Analysis of an Unsymmetrically-loaded Structure containing an Arbitrarily-shaped Cutout.- Quantitative Themographic Characterization of Composites.- Thermal Deformation of Micro-structure Diffuser Plate in LED Backlight Unit.- Polariscopy Measurement of Residual Stress in Thin Silicon Wafers.