Covers fundamentals, materials, techniques, processing, designs, characterizations, applications and equipment and future directions of additive manufacturing of ceramics.
Covers fundamentals, materials, techniques, processing, designs, characterizations, applications and equipment and future directions of additive manufacturing of ceramics.
Zhangwei Chen is currently a full professor and the director of Additive Manufacturing Institute at Shenzhen University. He is a distinguished scholar of the University. He earned his PhD from Imperial College London, and his master degree from Xi'an Jiaotong University and Ecole Centrale de Lyon. His research focuses on the additive manufacturing of high- performance materials, and he has published over 140 papers with a citation of 5700 times. Paolo Colombo is a professor at the University of Padova, Italy and an adjunct Professor at the State University of Pennsylvania in the United States. He has long been engaged in the preparation and additive manufacturing of non-metallic materials, especially advanced ceramics, glass and oligomer materials. So far, he has published more than 350 academic papers in journals.
Inhaltsangabe
1 INTRODUCTION 1.1 Properties and importance of ceramics 1.2 Typical conventional processing routes and fabrication techniques 1.3 Materials and processing related properties 1.4 Challenges and the need of additive manufacturing 1.5 References
2 VAT PHOTOPOLYMERIZATION OF CERAMICS 2.1 Linear scanning stereolithography 2.2 Planar photopolymerization 2.3 Two-photon polymerization 2.4 Other methods (including Volumetric Additive Manufacturing) 2.5 Process parameters 2.6 Heat treatment and post-processing 2.7 References
3 MATERIAL JETTING AND BINDER JETTING OF CERAMICS 3.1 Inkjet printing 3.2 Binder Jetting (including large scale BJ) 3.3 Process parameters 3.4 Heat treatment and post-processing 3.5 References
4 MATERIAL EXTRUSION OF CERAMICS 4.1 Direct ink writing 4.2 Fused deposition modeling 4.3 AM of fiber-reinforced composites 4.4 Other variants (e.g., Embedded-DIW and UV-DIW) 4.5 Process parameters 4.6 Heat treatment and post-processing 4.7 References
5 POWDER BED FUSION OF CERAMICS 5.1 Selective laser sintering 5.2 Selective laser melting 5.3 Process parameters 5.4 Heat treatment and post-processing 5.5 References
6 DIRECT ENERGY DEPOSITION OF CERAMICS 6.1 Fundamentals 6.2 Process parameters 6.3 Post-processing 6.4 References
7 OTHER METHODS 7.1 Sheet lamination 7.2 Robotic Arm Manufacturing 7.3 Hybrid printing methods 7.4 References
8 DESIGN AND CHARACTERIZATION ASPECTS OF AM OF CERAMICS 8.1 Model design - general rules for ceramic AM 8.2 Topological optimization and numerical simulation 8.3 Characterization of the feedstocks prior to printing 8.4 Characterization of the parts before and after heat processing (surface roughness, purity, porosity, mechanical pr opoperties...) 8.5 References
9 APPLICATIONS AND IMPACTS OF AM OF CERAMICS 9.1 General load bearing applications (include Aerospace and propulsion/Molds) 9.2 Functional applications (include electronics, electromagnetic absorption, catalysis and energy devices) 9.3 Biomedicine and others 9.4 Standardization 9.5 Life cycle assessment of ceramic AM 9.6 Social, educational and economic impacts 9.7 References
10 INDUSTRIAL EQUIPMENT DEVELOPMENT AND MARKET 10.1 R&D status for ceramic AM equipment 10.2 Commercially available equipment 10.3 Market and perspectives 10.4 References
11 DEVELOPMENT OF NEW ASPECTS AND PROSPECTIVES 11.1 Green/smart design and manufacturing 11.2 4D/5D printing 11.3 Potentials and challenges 11.4 References
1 INTRODUCTION 1.1 Properties and importance of ceramics 1.2 Typical conventional processing routes and fabrication techniques 1.3 Materials and processing related properties 1.4 Challenges and the need of additive manufacturing 1.5 References
2 VAT PHOTOPOLYMERIZATION OF CERAMICS 2.1 Linear scanning stereolithography 2.2 Planar photopolymerization 2.3 Two-photon polymerization 2.4 Other methods (including Volumetric Additive Manufacturing) 2.5 Process parameters 2.6 Heat treatment and post-processing 2.7 References
3 MATERIAL JETTING AND BINDER JETTING OF CERAMICS 3.1 Inkjet printing 3.2 Binder Jetting (including large scale BJ) 3.3 Process parameters 3.4 Heat treatment and post-processing 3.5 References
4 MATERIAL EXTRUSION OF CERAMICS 4.1 Direct ink writing 4.2 Fused deposition modeling 4.3 AM of fiber-reinforced composites 4.4 Other variants (e.g., Embedded-DIW and UV-DIW) 4.5 Process parameters 4.6 Heat treatment and post-processing 4.7 References
5 POWDER BED FUSION OF CERAMICS 5.1 Selective laser sintering 5.2 Selective laser melting 5.3 Process parameters 5.4 Heat treatment and post-processing 5.5 References
6 DIRECT ENERGY DEPOSITION OF CERAMICS 6.1 Fundamentals 6.2 Process parameters 6.3 Post-processing 6.4 References
7 OTHER METHODS 7.1 Sheet lamination 7.2 Robotic Arm Manufacturing 7.3 Hybrid printing methods 7.4 References
8 DESIGN AND CHARACTERIZATION ASPECTS OF AM OF CERAMICS 8.1 Model design - general rules for ceramic AM 8.2 Topological optimization and numerical simulation 8.3 Characterization of the feedstocks prior to printing 8.4 Characterization of the parts before and after heat processing (surface roughness, purity, porosity, mechanical pr opoperties...) 8.5 References
9 APPLICATIONS AND IMPACTS OF AM OF CERAMICS 9.1 General load bearing applications (include Aerospace and propulsion/Molds) 9.2 Functional applications (include electronics, electromagnetic absorption, catalysis and energy devices) 9.3 Biomedicine and others 9.4 Standardization 9.5 Life cycle assessment of ceramic AM 9.6 Social, educational and economic impacts 9.7 References
10 INDUSTRIAL EQUIPMENT DEVELOPMENT AND MARKET 10.1 R&D status for ceramic AM equipment 10.2 Commercially available equipment 10.3 Market and perspectives 10.4 References
11 DEVELOPMENT OF NEW ASPECTS AND PROSPECTIVES 11.1 Green/smart design and manufacturing 11.2 4D/5D printing 11.3 Potentials and challenges 11.4 References
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