Creep and Fracture of Engineering Materials and Structures: Proceedings of the 9th International Conference: Proceedings of the 9th International Conference

Proceedings of the 9th International Conference
Herausgeber: Parker, J. D.

• Gebundenes Buch

Produktdetails

• Verlag: Maney Publishing
• 9. Auflage
• Seitenzahl: 814
• Erscheinungstermin: 20. Dezember 2001
• Englisch
• Abmessung: 234mm x 156mm
• Gewicht: 1622g
• ISBN-13: 9781861251442
• ISBN-10: 1861251440
• Artikelnr.: 75321909

Autorenporträt

Edited by J D Parker Department af Materials Engineering, University of Wales Swansea

Inhaltsangabe

CREEP FUNDAMENTALS I: Key microstructural features of diffusional creep
Z = 3 Grain boundaries in Cu-Ni subjected to diffusional creep
Creep of platinum alloys at extremely high temperatures
Fatigue behaviour of Cu-Si02 alloy at elevated temperatures CREEP FUNDAMENTALS II CREEP FUNDAMENTALS III CREEP OF CERAMICS
CREEP OF MAGNESIUM
CREEP OF ALUMINIUM I
CREEP OF ALUMINIUM II
CREEP OF ALUMINIUM III
CREEP OF INTERMETALLICS
CREEP OF COMPOSITES
SUPERALLOYS 1
SUPERALLOYS II
SUPERALLOYS III
ENGINEERING APPLICATION I
LOW ALLOY STEELS I
LOW ALLOY STEELS II
AUSTENTIC STEELS i
ENGINEERING APPLCIATIONS II
CRACK GROWTH.