Systematically introduces and summarizes the fundamental and experimental research results of recent progress on flexible electronic packaging and encapsulation technology.
Systematically introduces and summarizes the fundamental and experimental research results of recent progress on flexible electronic packaging and encapsulation technology.
Hong Meng, PhD, is Professor in the School of Advanced Materials at Peking University Shenzhen Graduate School, China. He has been working in the field of organic electronics for more than 30 years, including working at the Instute of Materials Science and Engineering (IMRE) in Singapore, Lucent Technologies Bell Labs, and DuPont Experimental Station. Wei Huang, PhD, is Professor at Frontiers Science Center for Flexible Electronics, Institute of Flexible Electronics, Northwestern Polytechnical University, China. He is Academician of Chinese Academy of Sciences, Russian Academy of Sciences, International Member of the National Academy of Engineering of USA, Academy of Engineering and Technology, Asian Pacific Academy of Materials, and Pakistan Academy of Sciences. He is an eminent scientist in the area of organic optoelectronics and flexible electronics.
Inhaltsangabe
1 OVERVIEW OF FLEXIBLE ELECTRONIC ENCAPSULATING TECHNOLOGY 1.1 Flexible electronics overview 1.2 Development of flexible electronic encapsulating technology 1.3 Encapsulating technology of several important flexible electronic devices 1.4 Flexible electronic encapsulating materials 1.5 Overview of the development of flexible electronic packaging at home and abroad
3 FLEXIBLE SUBSTRATES 3.1 Concept and connotation of flexible substrates 3.2 Development history of flexible substrates 3.3 Flexible substrate materials 3.4 Molding technology of flexible substrate 3.5 Performance evaluation of flexible substrates 3.6 Application of flexible substrates 3.7 Development trend of flexible substrates
4 TEST METHODS 4.1 Sealing test 4.2 Bending test 4.3 Mechanical performance testing 4.4 Stability testing
5 FLEXIBLE ELECTRONIC ENCAPSULATION 5.1 Inorganic encapsulating material 5.2 Organic encapsulating material 5.3 Organic-inorganic hybrid encapsulating material
6 DEVELOPMENT OF FLEXIBLE ELECTRONICS PACKAGING TECHNOLOGY 6.1 Flexible Electronics Packaging 6.2 Thin Film Packaging Technology
7 APPLICATION OF FLEXIBLE ELECTRONICS PACKAGING 7.1 Industry chain analysis of flexible electronics packaging 7.2 Packaging applications of flexible OLED devices 7.3 Packaging applications for flexible solar cells 7.4 Packaging applications for flexible electronic devices 7.5 Packaging applications for flexible electronics sensors
8 TESTING STANDARDS 8.1 Terminology and alphabetic symbols 8.2 Mechanical test method (deformation test) 8.3 Environmental test methods 8.4 Mechanical test methods (impact and hardness tests)
9 ANALYSIS OF FLEXIBLE ELECTRONIC PACKAGING ENTERPRISE 9.1 Flexible Electronic Packaging Enterprise 9.2 Analysis of Flexible Electronic Packaging Enterprises
10 FLEXIBLE ELECTRONICS PACKAGING DEVELOPMENT TRENDS 10.1 Flexible electronics packaging trends overview 10.2 Introduction of three packaging technologies for flexible electronic devices 10.3 Flexible electronics packaging development trend summary
1 OVERVIEW OF FLEXIBLE ELECTRONIC ENCAPSULATING TECHNOLOGY 1.1 Flexible electronics overview 1.2 Development of flexible electronic encapsulating technology 1.3 Encapsulating technology of several important flexible electronic devices 1.4 Flexible electronic encapsulating materials 1.5 Overview of the development of flexible electronic packaging at home and abroad
3 FLEXIBLE SUBSTRATES 3.1 Concept and connotation of flexible substrates 3.2 Development history of flexible substrates 3.3 Flexible substrate materials 3.4 Molding technology of flexible substrate 3.5 Performance evaluation of flexible substrates 3.6 Application of flexible substrates 3.7 Development trend of flexible substrates
4 TEST METHODS 4.1 Sealing test 4.2 Bending test 4.3 Mechanical performance testing 4.4 Stability testing
5 FLEXIBLE ELECTRONIC ENCAPSULATION 5.1 Inorganic encapsulating material 5.2 Organic encapsulating material 5.3 Organic-inorganic hybrid encapsulating material
6 DEVELOPMENT OF FLEXIBLE ELECTRONICS PACKAGING TECHNOLOGY 6.1 Flexible Electronics Packaging 6.2 Thin Film Packaging Technology
7 APPLICATION OF FLEXIBLE ELECTRONICS PACKAGING 7.1 Industry chain analysis of flexible electronics packaging 7.2 Packaging applications of flexible OLED devices 7.3 Packaging applications for flexible solar cells 7.4 Packaging applications for flexible electronic devices 7.5 Packaging applications for flexible electronics sensors
8 TESTING STANDARDS 8.1 Terminology and alphabetic symbols 8.2 Mechanical test method (deformation test) 8.3 Environmental test methods 8.4 Mechanical test methods (impact and hardness tests)
9 ANALYSIS OF FLEXIBLE ELECTRONIC PACKAGING ENTERPRISE 9.1 Flexible Electronic Packaging Enterprise 9.2 Analysis of Flexible Electronic Packaging Enterprises
10 FLEXIBLE ELECTRONICS PACKAGING DEVELOPMENT TRENDS 10.1 Flexible electronics packaging trends overview 10.2 Introduction of three packaging technologies for flexible electronic devices 10.3 Flexible electronics packaging development trend summary
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