It is now possible to design electronic systems that will operate reliably above the traditional temperature limit. To do this, however, requires a solid understanding of semiconductor physics, device processing, materials selection, package design, thermal management, and the application. With topics ranging from semiconductor device selection to testing and final assembly, High Temperature Electronics brings all of this information together into one volume. It offers unified, unsurpassed coverage of high temperature electronics, including techniques, tradeoffs, best design practices and applications such as avionics and geothermal measurements.…mehr
It is now possible to design electronic systems that will operate reliably above the traditional temperature limit. To do this, however, requires a solid understanding of semiconductor physics, device processing, materials selection, package design, thermal management, and the application. With topics ranging from semiconductor device selection to testing and final assembly, High Temperature Electronics brings all of this information together into one volume. It offers unified, unsurpassed coverage of high temperature electronics, including techniques, tradeoffs, best design practices and applications such as avionics and geothermal measurements.
McCluskey, F. Patrick; Podlesak, Thomas; Grzybowski, Richard
Inhaltsangabe
Chapter 1. Overview of High Temperature Electronics Chapter 2. Selection and Use of Silicon Devices at High Temperatures. Chapter 3. Wide Bandgap Semiconductors. Chapter 4. Passive Device Selection and Use at High Temperature. Chapter 5. First-level Packaging Considerations for the Use of Electronic Hardware at High Temperatures. Chapter 6. Second and Third Level Packaging Considerations for the Use of Electronic Hardware at High Temperatures. Chapter 7. Thermal Management Considerations for Elevated Temperature Chapter 8. Applications. Chapter 9. Accelerated Testing of Elevated Temperature Electronics. References. Index
Chapter 1. Overview of High Temperature Electronics Chapter 2. Selection and Use of Silicon Devices at High Temperatures. Chapter 3. Wide Bandgap Semiconductors. Chapter 4. Passive Device Selection and Use at High Temperature. Chapter 5. First-level Packaging Considerations for the Use of Electronic Hardware at High Temperatures. Chapter 6. Second and Third Level Packaging Considerations for the Use of Electronic Hardware at High Temperatures. Chapter 7. Thermal Management Considerations for Elevated Temperature Chapter 8. Applications. Chapter 9. Accelerated Testing of Elevated Temperature Electronics. References. Index
Chapter 1. Overview of High Temperature Electronics Chapter 2. Selection and Use of Silicon Devices at High Temperatures. Chapter 3. Wide Bandgap Semiconductors. Chapter 4. Passive Device Selection and Use at High Temperature. Chapter 5. First-level Packaging Considerations for the Use of Electronic Hardware at High Temperatures. Chapter 6. Second and Third Level Packaging Considerations for the Use of Electronic Hardware at High Temperatures. Chapter 7. Thermal Management Considerations for Elevated Temperature Chapter 8. Applications. Chapter 9. Accelerated Testing of Elevated Temperature Electronics. References. Index
Chapter 1. Overview of High Temperature Electronics Chapter 2. Selection and Use of Silicon Devices at High Temperatures. Chapter 3. Wide Bandgap Semiconductors. Chapter 4. Passive Device Selection and Use at High Temperature. Chapter 5. First-level Packaging Considerations for the Use of Electronic Hardware at High Temperatures. Chapter 6. Second and Third Level Packaging Considerations for the Use of Electronic Hardware at High Temperatures. Chapter 7. Thermal Management Considerations for Elevated Temperature Chapter 8. Applications. Chapter 9. Accelerated Testing of Elevated Temperature Electronics. References. Index
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