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The 3rd International Conference of Electronic Engineering and Information Science (ICEEIS2016) was held January 4-5, 2016 in Harbin, P.R. China. This conference is sponsored by Harbin University of Science and Technology. The topics covered at ICEEIS2016 include semiconductor materials, nano materials, mechanical materials, MEMS materials, electronic engineering, and information science.

Produktbeschreibung
The 3rd International Conference of Electronic Engineering and Information Science (ICEEIS2016) was held January 4-5, 2016 in Harbin, P.R. China. This conference is sponsored by Harbin University of Science and Technology. The topics covered at ICEEIS2016 include semiconductor materials, nano materials, mechanical materials, MEMS materials, electronic engineering, and information science.
Autorenporträt
Dongxing Wang received a Bachelor of Science degree and Master of Science degree from the Harbin University of Science and Technology, and a Ph.D. degree from Chiba University in 1984, 1990, and 1999 respectively. His current research interests include organic semiconductor devices and semiconductor process. Dongxing Wang currently holds a position at Harbin University of Science and Technology as professor.