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Plasma Processing of Semiconductors contains 28 contributions from 18 experts and covers plasma etching, plasma deposition, plasma-surface interactions, numerical modelling, plasma diagnostics, less conventional processing applications of plasmas, and industrial applications. Audience: Coverage ranges from introductory to state of the art, thus the book is suitable for graduate-level students seeking an introduction to the field as well as established workers wishing to broaden or update their knowledge.
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Plasma Processing of Semiconductors contains 28 contributions from 18 experts and covers plasma etching, plasma deposition, plasma-surface interactions, numerical modelling, plasma diagnostics, less conventional processing applications of plasmas, and industrial applications.
Audience: Coverage ranges from introductory to state of the art, thus the book is suitable for graduate-level students seeking an introduction to the field as well as established workers wishing to broaden or update their knowledge.
Audience: Coverage ranges from introductory to state of the art, thus the book is suitable for graduate-level students seeking an introduction to the field as well as established workers wishing to broaden or update their knowledge.
Produktdetails
- Produktdetails
- Nato Science Series E: 336
- Verlag: Springer / Springer Netherlands
- Artikelnr. des Verlages: 978-0-7923-4567-1
- 1997.
- Seitenzahl: 628
- Erscheinungstermin: 31. Mai 1997
- Englisch
- Abmessung: 241mm x 160mm x 38mm
- Gewicht: 1052g
- ISBN-13: 9780792345671
- ISBN-10: 0792345673
- Artikelnr.: 22073009
- Herstellerkennzeichnung
- Springer-Verlag GmbH
- Tiergartenstr. 17
- 69121 Heidelberg
- ProductSafety@springernature.com
- Nato Science Series E: 336
- Verlag: Springer / Springer Netherlands
- Artikelnr. des Verlages: 978-0-7923-4567-1
- 1997.
- Seitenzahl: 628
- Erscheinungstermin: 31. Mai 1997
- Englisch
- Abmessung: 241mm x 160mm x 38mm
- Gewicht: 1052g
- ISBN-13: 9780792345671
- ISBN-10: 0792345673
- Artikelnr.: 22073009
- Herstellerkennzeichnung
- Springer-Verlag GmbH
- Tiergartenstr. 17
- 69121 Heidelberg
- ProductSafety@springernature.com
Plasma Etching.- to Plasma Etching.- Plasma Chemistry, Basic Processes and PECVD.- The Role of Ions in Reactive Ion Etching with Low Density Plasmas.- SiO2 Etching in High-Density Plasmas: Differences with Low-Density Plasmas.- Plasma Deposition.- to Plasma Enhanced Chemical Vapor Deposition.- Topography Evolution During Semiconductor Processing.- Deposition of Amorphous Silicon.- Plasma Sources.- High Density Sources for Plasma Etching.- Resonant Plasma Excitation by Electron Cyclotron Waves-Fundamentals and Applications.- The Transition from Capacitive to Inductive to Wave Sustained Discharges.- Physics of Surface-Wave Discharges.- Plasma-Surface Interactions.- Surface Science Aspects of Etching and Wall Reactions in High Density Plasmas.- Plasma-Surface Interactions.- Cl2 Plasma-Si Surface Interactions in Plasma Etching.- Numerical Modeling.- Particle in Cell Monte Carlo Collision Codes (PIC-MCC); Methods and Applications to Plasma Processing.- Fluid and Hybrid Models of Non Equilibrium Discharges.- Plasma Diagnostics.- Optical Diagnostics of Processing Plasmas.- Optical Diagnostics of Plasmas: A Tool for Process Control.- Infrared Absorption Spectroscopy as a Diagnostic for Processing Plasmas.- Ellipsometric Analysis of Plasma Deposited and Plasma Etched Materials.- Mass Spectrometry of Reactive Plasmas.- Less Conventional Processing Applications of Plasmas.- Deposition of Silicon Dioxide Films using the Helicon Diffusion Reactor for Integrated Optics Applications.- Remote Plasma Processing.- Magnetized Surface-Wave Discharges for Submicrometer Pattern Transfer.- Dusty Plasmas: Fundamental Aspects and Industrial Applications.- Industrial Application of Plasmas for Processing.- Low Energy Plasma Beams for Semiconductor Technology.- Process Control Concepts.- Issuesand Solutions for Applying Process Control to Semiconductor Manufacturing.
Plasma Etching.- to Plasma Etching.- Plasma Chemistry, Basic Processes and PECVD.- The Role of Ions in Reactive Ion Etching with Low Density Plasmas.- SiO2 Etching in High-Density Plasmas: Differences with Low-Density Plasmas.- Plasma Deposition.- to Plasma Enhanced Chemical Vapor Deposition.- Topography Evolution During Semiconductor Processing.- Deposition of Amorphous Silicon.- Plasma Sources.- High Density Sources for Plasma Etching.- Resonant Plasma Excitation by Electron Cyclotron Waves-Fundamentals and Applications.- The Transition from Capacitive to Inductive to Wave Sustained Discharges.- Physics of Surface-Wave Discharges.- Plasma-Surface Interactions.- Surface Science Aspects of Etching and Wall Reactions in High Density Plasmas.- Plasma-Surface Interactions.- Cl2 Plasma-Si Surface Interactions in Plasma Etching.- Numerical Modeling.- Particle in Cell Monte Carlo Collision Codes (PIC-MCC); Methods and Applications to Plasma Processing.- Fluid and Hybrid Models of Non Equilibrium Discharges.- Plasma Diagnostics.- Optical Diagnostics of Processing Plasmas.- Optical Diagnostics of Plasmas: A Tool for Process Control.- Infrared Absorption Spectroscopy as a Diagnostic for Processing Plasmas.- Ellipsometric Analysis of Plasma Deposited and Plasma Etched Materials.- Mass Spectrometry of Reactive Plasmas.- Less Conventional Processing Applications of Plasmas.- Deposition of Silicon Dioxide Films using the Helicon Diffusion Reactor for Integrated Optics Applications.- Remote Plasma Processing.- Magnetized Surface-Wave Discharges for Submicrometer Pattern Transfer.- Dusty Plasmas: Fundamental Aspects and Industrial Applications.- Industrial Application of Plasmas for Processing.- Low Energy Plasma Beams for Semiconductor Technology.- Process Control Concepts.- Issuesand Solutions for Applying Process Control to Semiconductor Manufacturing.







