This book provides cutting-edge information about materials, technologies and mechanisms of printed electronics, and their applications for the smart packaging.
This book provides cutting-edge information about materials, technologies and mechanisms of printed electronics, and their applications for the smart packaging.
Wei Wu is full professor of School of Physics and Technology, Wuhan University. He received the State Scientific Innovation and Pioneer Award in 2023, the 15th Bi Sheng Award of Printing Technology in 2019, the STAM Best Paper Award in 2017, and the Hong Kong Scholars Award in 2014.
Inhaltsangabe
Chapter 1 Introduction of Printed Electronics and Smart Packaging Chapter 2 Mechanisms and Strategies of Smart Packaging Chapter 3 Printing Methods and Integrated Strategies Chapter 4 Functional Inks and Substrates for Smart Packaging Chapter 5 Printed Tracks for Smart Tags and Packaging Chapter 6 Printed Optoelectronic Devices and Energy Suppliers for Smart Packaging Chapter 7 Printed Sensors and Indicators Chapter 8 Integrated Printed Electronics Systems Chapter 9 Outlooks and Perspectives
Chapter 1 Introduction of Printed Electronics and Smart Packaging Chapter 2 Mechanisms and Strategies of Smart Packaging Chapter 3 Printing Methods and Integrated Strategies Chapter 4 Functional Inks and Substrates for Smart Packaging Chapter 5 Printed Tracks for Smart Tags and Packaging Chapter 6 Printed Optoelectronic Devices and Energy Suppliers for Smart Packaging Chapter 7 Printed Sensors and Indicators Chapter 8 Integrated Printed Electronics Systems Chapter 9 Outlooks and Perspectives
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