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Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany.
The 16 papers are grouped as follows:
Chapter 1: Development and Prototyping,
Chapter 2: Printing Technologies,
Chapter 3: Materials and Manufacturing,
Chapter 4: Manufacturing Processes,
Chapter 5: Assembly Technologies and Inspection,
Chapter 6: Quality and Reliability.
The 16 papers are grouped as follows:
Chapter 1: Development and Prototyping,
Chapter 2: Printing Technologies,
Chapter 3: Materials and Manufacturing,
Chapter 4: Manufacturing Processes,
Chapter 5: Assembly Technologies and Inspection,
Chapter 6: Quality and Reliability.
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