The 114 papers are grouped as follows:
Chapter 1: Grinding
Chapter 2: Abrasive Jet Machining
Chapter 3: Advanced Cutting Technology
Chapter 4: Processing of Brittle Materials
Chapter 5: Chemical Mechanical Polishing, Processing of Semiconductor Wafer
Chapter 6: Electrical Discharge Machining, Ultrasonic and Beam Machining
Chapter 7: Finishing, Lapping and Polishing
Chapter 8: Surface and Subsurface Integrity and Materials Characterization
Chapter 9: In-Process Measurement and Monitoring, Metrology
Chapter 10: Machine Tools and Systems, Tooling Processing
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