Handbook of Moire Measurement (eBook, ePUB)
Redaktion: Walker, C. A.
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Handbook of Moire Measurement (eBook, ePUB)
Redaktion: Walker, C. A.
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Since its development in the late 1970s, the Moire Fringe method has become a standard technique for the measurement of the behavior of materials and structures. Edited by one of the co-inventors of the technique, the Handbook of Moire Measurement brings together a series of extended case studies from recognized experts in the field. The emphasis i
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Since its development in the late 1970s, the Moire Fringe method has become a standard technique for the measurement of the behavior of materials and structures. Edited by one of the co-inventors of the technique, the Handbook of Moire Measurement brings together a series of extended case studies from recognized experts in the field. The emphasis i
Dieser Download kann aus rechtlichen Gründen nur mit Rechnungsadresse in A, B, BG, CY, CZ, D, DK, EW, E, FIN, F, GR, HR, H, IRL, I, LT, L, LR, M, NL, PL, P, R, S, SLO, SK ausgeliefert werden.
Produktdetails
- Produktdetails
- Verlag: Taylor & Francis eBooks
- Seitenzahl: 501
- Erscheinungstermin: 1. Dezember 2003
- Englisch
- ISBN-13: 9781000687408
- Artikelnr.: 57530962
- Verlag: Taylor & Francis eBooks
- Seitenzahl: 501
- Erscheinungstermin: 1. Dezember 2003
- Englisch
- ISBN-13: 9781000687408
- Artikelnr.: 57530962
- Herstellerkennzeichnung Die Herstellerinformationen sind derzeit nicht verfügbar.
CA Walker Department of Mechanical Engineering, University of Strathclyde, UK
1 Introduction
1.1 A brief history of the moiré method
References
CHAPTER 2: STRAIN MEASUREMENTS AT THE LIMIT-THE MOIRÉ MICROSCOPE
2.1 Nonlinear analysis of interferometric moiré fringes
2.1.1 Example fringe data reduction
References
2.2 Microscopic moiré interferometry
2.2.1 Immersion interferometer
2.2.1.1 Optical configuration
2.2.1.2 Four-beam immersion interferometer
2.2.2 Mechanical configuration
2.2.3 Fringe shifting and O/DFM method
References
2.3 Localized thermal strains in electronic interconnections by microscopic moiré interferometry
2.3.1 Specimen preparation
2.3.2 Thin small outline package
2.3.3 Leadless chip carrier
2.3.4 Effect of underfill encapsulation on flip chip solder bump
2.3.5 Plated through hole
References
2.4 Titanium in elastic tension: micromechanical deformation
2.4.1 Introduction
2.4.2 Specimen and loading fixture
2.4.3 Experimental procedure and fringe patterns
2.4.4 Anomalous strains along the grain boundaries
2.4.5 Discussion
References
2.5 Micromechanical thermal deformation of unidirectional boron/aluminum composite
2.5.1 Experimental procedure and fringe patterns
2.5.2 Analysis and results
2.5.3 Discussion
References
CHAPTER 3: FRACTURE MECHANICS
3.1.1 Assessment of the shape of crack-tip plastic zones as a function of applied load
3.1.1.1 Introduction
3.1.1.2 Experimental details
3.1.1.3 Measurement of Von Mises yield locus
3.1.1.4 Discussion of results
3.1.1.5 Conclusions
References
3.1.2 Deformation around fatigue cracks from moiré fringe measurement
3.1.2.1 Introduction
3.1.2.2 Basic crack-tip models
3.1.2.2.1 Stationary crack under monotonie loading
3.1.2.2.2 Stationary crack under cyclic loading
3.1.2.3 Experimental details
3.1.2.4 Fatigue crack-tip deformation
3.1.2.4.1 Local yielding
3.1.2.4.2 Non-singular stresses
3.1.2.4.3 Cyclic plasticity
3.1.2.4.4 Local mode-mixity
3.1.2.5 Summary
Acknowledgment
References
3.2.1 Applications of moiré to cellulosic (paper and woo
1.1 A brief history of the moiré method
References
CHAPTER 2: STRAIN MEASUREMENTS AT THE LIMIT-THE MOIRÉ MICROSCOPE
2.1 Nonlinear analysis of interferometric moiré fringes
2.1.1 Example fringe data reduction
References
2.2 Microscopic moiré interferometry
2.2.1 Immersion interferometer
2.2.1.1 Optical configuration
2.2.1.2 Four-beam immersion interferometer
2.2.2 Mechanical configuration
2.2.3 Fringe shifting and O/DFM method
References
2.3 Localized thermal strains in electronic interconnections by microscopic moiré interferometry
2.3.1 Specimen preparation
2.3.2 Thin small outline package
2.3.3 Leadless chip carrier
2.3.4 Effect of underfill encapsulation on flip chip solder bump
2.3.5 Plated through hole
References
2.4 Titanium in elastic tension: micromechanical deformation
2.4.1 Introduction
2.4.2 Specimen and loading fixture
2.4.3 Experimental procedure and fringe patterns
2.4.4 Anomalous strains along the grain boundaries
2.4.5 Discussion
References
2.5 Micromechanical thermal deformation of unidirectional boron/aluminum composite
2.5.1 Experimental procedure and fringe patterns
2.5.2 Analysis and results
2.5.3 Discussion
References
CHAPTER 3: FRACTURE MECHANICS
3.1.1 Assessment of the shape of crack-tip plastic zones as a function of applied load
3.1.1.1 Introduction
3.1.1.2 Experimental details
3.1.1.3 Measurement of Von Mises yield locus
3.1.1.4 Discussion of results
3.1.1.5 Conclusions
References
3.1.2 Deformation around fatigue cracks from moiré fringe measurement
3.1.2.1 Introduction
3.1.2.2 Basic crack-tip models
3.1.2.2.1 Stationary crack under monotonie loading
3.1.2.2.2 Stationary crack under cyclic loading
3.1.2.3 Experimental details
3.1.2.4 Fatigue crack-tip deformation
3.1.2.4.1 Local yielding
3.1.2.4.2 Non-singular stresses
3.1.2.4.3 Cyclic plasticity
3.1.2.4.4 Local mode-mixity
3.1.2.5 Summary
Acknowledgment
References
3.2.1 Applications of moiré to cellulosic (paper and woo
1 Introduction
1.1 A brief history of the moiré method
References
CHAPTER 2: STRAIN MEASUREMENTS AT THE LIMIT-THE MOIRÉ MICROSCOPE
2.1 Nonlinear analysis of interferometric moiré fringes
2.1.1 Example fringe data reduction
References
2.2 Microscopic moiré interferometry
2.2.1 Immersion interferometer
2.2.1.1 Optical configuration
2.2.1.2 Four-beam immersion interferometer
2.2.2 Mechanical configuration
2.2.3 Fringe shifting and O/DFM method
References
2.3 Localized thermal strains in electronic interconnections by microscopic moiré interferometry
2.3.1 Specimen preparation
2.3.2 Thin small outline package
2.3.3 Leadless chip carrier
2.3.4 Effect of underfill encapsulation on flip chip solder bump
2.3.5 Plated through hole
References
2.4 Titanium in elastic tension: micromechanical deformation
2.4.1 Introduction
2.4.2 Specimen and loading fixture
2.4.3 Experimental procedure and fringe patterns
2.4.4 Anomalous strains along the grain boundaries
2.4.5 Discussion
References
2.5 Micromechanical thermal deformation of unidirectional boron/aluminum composite
2.5.1 Experimental procedure and fringe patterns
2.5.2 Analysis and results
2.5.3 Discussion
References
CHAPTER 3: FRACTURE MECHANICS
3.1.1 Assessment of the shape of crack-tip plastic zones as a function of applied load
3.1.1.1 Introduction
3.1.1.2 Experimental details
3.1.1.3 Measurement of Von Mises yield locus
3.1.1.4 Discussion of results
3.1.1.5 Conclusions
References
3.1.2 Deformation around fatigue cracks from moiré fringe measurement
3.1.2.1 Introduction
3.1.2.2 Basic crack-tip models
3.1.2.2.1 Stationary crack under monotonie loading
3.1.2.2.2 Stationary crack under cyclic loading
3.1.2.3 Experimental details
3.1.2.4 Fatigue crack-tip deformation
3.1.2.4.1 Local yielding
3.1.2.4.2 Non-singular stresses
3.1.2.4.3 Cyclic plasticity
3.1.2.4.4 Local mode-mixity
3.1.2.5 Summary
Acknowledgment
References
3.2.1 Applications of moiré to cellulosic (paper and woo
1.1 A brief history of the moiré method
References
CHAPTER 2: STRAIN MEASUREMENTS AT THE LIMIT-THE MOIRÉ MICROSCOPE
2.1 Nonlinear analysis of interferometric moiré fringes
2.1.1 Example fringe data reduction
References
2.2 Microscopic moiré interferometry
2.2.1 Immersion interferometer
2.2.1.1 Optical configuration
2.2.1.2 Four-beam immersion interferometer
2.2.2 Mechanical configuration
2.2.3 Fringe shifting and O/DFM method
References
2.3 Localized thermal strains in electronic interconnections by microscopic moiré interferometry
2.3.1 Specimen preparation
2.3.2 Thin small outline package
2.3.3 Leadless chip carrier
2.3.4 Effect of underfill encapsulation on flip chip solder bump
2.3.5 Plated through hole
References
2.4 Titanium in elastic tension: micromechanical deformation
2.4.1 Introduction
2.4.2 Specimen and loading fixture
2.4.3 Experimental procedure and fringe patterns
2.4.4 Anomalous strains along the grain boundaries
2.4.5 Discussion
References
2.5 Micromechanical thermal deformation of unidirectional boron/aluminum composite
2.5.1 Experimental procedure and fringe patterns
2.5.2 Analysis and results
2.5.3 Discussion
References
CHAPTER 3: FRACTURE MECHANICS
3.1.1 Assessment of the shape of crack-tip plastic zones as a function of applied load
3.1.1.1 Introduction
3.1.1.2 Experimental details
3.1.1.3 Measurement of Von Mises yield locus
3.1.1.4 Discussion of results
3.1.1.5 Conclusions
References
3.1.2 Deformation around fatigue cracks from moiré fringe measurement
3.1.2.1 Introduction
3.1.2.2 Basic crack-tip models
3.1.2.2.1 Stationary crack under monotonie loading
3.1.2.2.2 Stationary crack under cyclic loading
3.1.2.3 Experimental details
3.1.2.4 Fatigue crack-tip deformation
3.1.2.4.1 Local yielding
3.1.2.4.2 Non-singular stresses
3.1.2.4.3 Cyclic plasticity
3.1.2.4.4 Local mode-mixity
3.1.2.5 Summary
Acknowledgment
References
3.2.1 Applications of moiré to cellulosic (paper and woo







