Fred W. Kear

Hybrid Assemblies and Multichip Modules (eBook, ePUB)

• Format: ePub

Produktbeschreibung

Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Mul

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Produktdetails

• Verlag: Taylor & Francis eBooks
• Seitenzahl: 296
• Altersempfehlung: ab 12 Jahre
• Erscheinungstermin: 24. Juli 2020
• Englisch
• ISBN-13: 9781000147803
• Artikelnr.: 59806380

Autorenporträt

Fred W. Kear is a manufacturing manager at Mototola Inc., in Albuquerque, New Mexico. He is the author of three books: The Design and Manufacture of Printed Circuits, Production Engineering, and Printed Circuit Assembly Manufacturing (Marcel Dekker, Inc.). A member of the Institute of Printed Circuits, Mr. Kear was also the chief contributor to the Sourcebook of Electronic Circuits, and contributing author to Tunnel Diodes and Semiconductor Circuits, Design Manual for Transistor Circuits, and Modem Digital Circuits. In addition, he has written approximately 200 technical papers that have been published in professional journals.

Inhaltsangabe

An overview of hybrid assemblies
design and development of hybrid assemblies
ceramic substrates
thick-film and thin-film circuits
screened passive components
surface-mount components
interconnection technologies
component placement and soldering
testing methods
coating, encapsulating and marking
installing and using the hybrid assembly
quality assessment of hybrid assemblies
microchip modules.