Fred W. Kear

Hybrid Assemblies and Multichip Modules (eBook, PDF)

• Format: PDF

Produktbeschreibung

Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.

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Produktdetails

• Verlag: Taylor & Francis eBooks
• Seitenzahl: 296
• Altersempfehlung: ab 12 Jahre
• Erscheinungstermin: 24. Juli 2020
• Englisch
• ISBN-13: 9781000104592
• Artikelnr.: 59805030

Autorenporträt

Fred W. Kear is a manufacturing manager at Mototola Inc., in Albuquerque, New Mexico. He is the author of three books: The Design and Manufacture of Printed Circuits, Production Engineering, and Printed Circuit Assembly Manufacturing (Marcel Dekker, Inc.). A member of the Institute of Printed Circuits, Mr. Kear was also the chief contributor to the Sourcebook of Electronic Circuits, and contributing author to Tunnel Diodes and Semiconductor Circuits, Design Manual for Transistor Circuits, and Modem Digital Circuits. In addition, he has written approximately 200 technical papers that have been published in professional journals.

Inhaltsangabe

An overview of hybrid assemblies
design and development of hybrid assemblies
ceramic substrates
thick-film and thin-film circuits
screened passive components
surface-mount components
interconnection technologies
component placement and soldering
testing methods
coating, encapsulating and marking
installing and using the hybrid assembly
quality assessment of hybrid assemblies
microchip modules.