John Lau, Xuejun Fan

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration (eBook, PDF)

• Format: PDF

Produktbeschreibung

The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.

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Produktdetails

• Verlag: Springer Nature Singapore
• Seitenzahl: 645
• Erscheinungstermin: 18. Mai 2025
• Englisch
• ISBN-13: 9789819641666
• Artikelnr.: 74244312

Autorenporträt

John H. Lau was the CTO from July 2019 to July 2021 and has been a Senior Special Project Assistant since August 2021 of Unimicron in Taiwan. Prior to that, he was a Senior Technical Advisor at ASM Pacific Technology in Hong Kong for 5 years; a specialist of the Industrial Technology Research Institute in Taiwan for 5 years; a Visiting Professor at Hong Kong University of Science and Technology for 1 year; the Director of the Microsystems, Modules, and Components Laboratory at the Institute of Microelectronics in Singapore for 2 years; and a Senior Scientist/MTS at Hewlett-Packard Laboratory/Agilent in California for more than 25 years. He earned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at Urbana-Champaign, an M.A.Sc. degree in structural engineering from the University of British Columbia, a second M.S. degree in engineering mechanics from the University of Wisconsin at Madison, and a third M.S. degree in management science from Fairleigh Dickinson University in New Jersey. He also has a B.E. degree in civil engineering from National Taiwan University.

Dr. Xuejun Fan, Regents' Professor of the Texas State University System and Mary Ann and Lawrence E. Faust Endowed Professor at Lamar University, is internationally recognized for his expertise in electronic packaging reliability and modeling. With over 25 years of experience spanning academia and industry, he has held key roles at the Institute of Microelectronics in Singapore, Philips Research in New York, and Intel Corporation in Arizona. Dr. Fan has authored 4 books, 25 book chapters, and over 340 technical papers, holds multiple patents, and provides consultancy for global patent litigation. A sought-after speaker, he has delivered numerous tutorials, workshops, and keynote lectures worldwide. He is an IEEE Fellow, a long-standing IEEE Distinguished Lecturer, and Associate Editor for multiple leading journals, including IEEE Transactions on Components, Packaging and Manufacturing Technology. He has received prestigious honors such as the IEEE EPS Outstanding Sustained Technical Contribution Award (2017), EuroSimE Achievement Award (2023), and consistent recognition among the top 2% of scientists globally by Stanford University. Earlier in his career, he became one of China's youngest full professors at age 27 while at Taiyuan University of Technology, where he held leadership roles and advanced research in applied mechanics. Dr. Fan earned his Ph.D. in Solid Mechanics from Tsinghua University and his B.S. and M.S. from Tianjin University, solidifying his foundation in applied mechanics and reliability engineering.

Inhaltsangabe

Chiplet Design and Heterogeneous Integration Packaging.- Advanced Substrates for Chiplet and Heterogeneous Integration.- Cu-Cu Bumpless Hybrid Bonding.- Warpage Management in Semiconductor Packaging.- Simulation and Optimization of Thermal-Mechanical and Mechanical Reliability of Solder Joint.- Moisture Reliability, Failure Mechanisms and Moisture Diffusion Modeling.- Design Rules for Electromigration Failure.- Thermal Management.