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Autorenporträt
James E. Morris is Professor of Electrical & Computer Engineering at Portland State University, Oregon. He has edited or co-authored five books on electronic packaging, and has more on the way.
Inhaltsangabe
Nanopackaging: Nanotechnologies and Electronics Packaging.- Modelling Technologies and Applications.- Advances in Delamination Modeling: Continuum Aspects.- Advances in Delamination Modeling: Atomistic Aspects.- Soft Mold Nano-imprint: Modeling and Simulation.- Nanoparticle Properties.- Nanoparticle Fabrication.- Nanoparticle-based High-k Dielectric Composites for Embedded Capacitors.- Nanostructured Materials for Embedded Resistors.- Nanogranular Magnetic Core Inductors: Design, Fabrication and Packaging.- Nanoparticles in Isotropic Conductive Adhesives.- Nano materials in Anisotropic Conductive Adhesives (ACAs).- Nanoparticles in Microvias.- Silver Nanoparticles for Inkjet Printed Conductive Structures in Electronic Packaging.- A Study of Nano Particles in SnAg-Based Lead Free Solders.- Nano-Underfills for Fine Pitch Electronics.- Carbon Nanotubes: Synthesis and Characterization.- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications.- High Electromagnetic Shielding of Plastic Transceiver Packaging Using Dispersed Multiwall Carbon Nanotubes.- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced with Single-Wall Carbon Nanotubes.- Carbon Nanotubes for Thermal Management of Microsystems.- Nanowires in Electronics Packaging.- Nanowire ACF for Ultrafine pitch Flip-Chip Interconnection.- Synthesis and Optical Characterization of CVD Graphene.- Characterization of electronic, electrical, optical and mechanical properties of grapheme.- Graphene for Thermal Cooling of Microelectronics.- Carbon Interconnects.- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging.- Nanosensors for Electronics Package Reliability.- Applications of Bio-Nanotechnology to Electronics Packaging.- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities.- Nanotechnology Health, Safety, Environment Overview.
Nanopackaging: Nanotechnologies and Electronics Packaging.- Modelling Technologies and Applications.- Advances in Delamination Modeling: Continuum Aspects.- Advances in Delamination Modeling: Atomistic Aspects.- Soft Mold Nano-imprint: Modeling and Simulation.- Nanoparticle Properties.- Nanoparticle Fabrication.- Nanoparticle-based High-k Dielectric Composites for Embedded Capacitors.- Nanostructured Materials for Embedded Resistors.- Nanogranular Magnetic Core Inductors: Design, Fabrication and Packaging.- Nanoparticles in Isotropic Conductive Adhesives.- Nano materials in Anisotropic Conductive Adhesives (ACAs).- Nanoparticles in Microvias.- Silver Nanoparticles for Inkjet Printed Conductive Structures in Electronic Packaging.- A Study of Nano Particles in SnAg-Based Lead Free Solders.- Nano-Underfills for Fine Pitch Electronics.- Carbon Nanotubes: Synthesis and Characterization.- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications.- High Electromagnetic Shielding of Plastic Transceiver Packaging Using Dispersed Multiwall Carbon Nanotubes.- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced with Single-Wall Carbon Nanotubes.- Carbon Nanotubes for Thermal Management of Microsystems.- Nanowires in Electronics Packaging.- Nanowire ACF for Ultrafine pitch Flip-Chip Interconnection.- Synthesis and Optical Characterization of CVD Graphene.- Characterization of electronic, electrical, optical and mechanical properties of grapheme.- Graphene for Thermal Cooling of Microelectronics.- Carbon Interconnects.- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging.- Nanosensors for Electronics Package Reliability.- Applications of Bio-Nanotechnology to Electronics Packaging.- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities.- Nanotechnology Health, Safety, Environment Overview.
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