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Providing researchers and engineers with invaluable practical hints on how to develop novel RF-MEMS device concepts, this book deals with modeling, design, simulation, optimization, fabrication and characterization of MEMS for radiofrequency applications. To begin with, prototypical RF-MEMS devices, including lumped components and complex networks, are presented as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. The text explicitly treats the hard-to-predict interplay between the…mehr
Providing researchers and engineers with invaluable practical hints on how to develop novel RF-MEMS device concepts, this book deals with modeling, design, simulation, optimization, fabrication and characterization of MEMS for radiofrequency applications. To begin with, prototypical RF-MEMS devices, including lumped components and complex networks, are presented as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. The text explicitly treats the hard-to-predict interplay between the three-dimensional device structure and its electromagnetic functionality. Theoretical concepts are introduced when necessary to complement the practical hints given for all RF-MEMS development stages, and simulation results are validated against experimental results. With its design and simulation examples based on such widely-known software packages as ANSYS and the hardware description language Verilog, this guide will appeal to the practice-oriented R&D reader.
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Autorenporträt
Jacopo Iannacci is Researcher in MEMS technology at the Fondazione Bruno Kessler - FBK in Trento, Italy, where he focuses on (compact) modeling, design, optimization, integration, packaging and testing for reliability of MEMS/RF-MEMS devices and networks for sensors/actuators, energy harvesting and telecommunication systems. He received the PhD in Information Technology from the ARCES Research Center of the University of Bologna, Italy, and worked as Visiting Researcher at the DIMES Technology Center of the Technical University of Delft, the Netherlands, on development of packaging and integration solutions for RF-MEMS devices. Jacopo Iannacci authored and co-authored numerous scientifi c contributions for international journals and conference proceedings, as well as books and several book chapters in the fi eld of MEMS and RFMEMS technology.
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