Features
- Covers stressstrain engineering in semiconductor devices, such as FinFETs and III-V Nitride-based devices
- Includes comprehensive mobility model for strained substrates in global and local strain techniques and their implementation in device simulations
- Explains the development of strain/stress relationships and their effects on the band structures of strained substrates
- Uses design of experiments to find the optimum process conditions
- Illustrates the use of TCAD for modeling strain-engineered FinFETs for DC and AC performance predictions
This book is for graduate students and researchers studying solid-state devices and materials, microelectronics, systems and controls, power electronics, nanomaterials, and electronic materials and devices.
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