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Inhaltsangabe
1. lntroduction.- 1.1 The Significance of Semiconductor Integrated Circuits.- 1.2 Prospects of High-Density Integration.- 1.3 Device Dimensions and Density of Integration.- 1.4 Outline of the Microfabrication Technology.- 2. Electron Beam Lithography.- 2.1 Background.- 2.2 Components for Electron-Beam Lithography.- 2.3 Software for Electron-Beam Lithography.- 2.4 Wafer and Writing Systems.- 3. Pattern Replication Technology.- 3.1 UV Replication Technologies.- 3.2 Deep-UV Projection System.- 3.3 X-Ray Lithography.- 3.4 Electron-Beam Projection.- 3.5 Radiation-Sensitive Resist for Microfabrication.- 4. Mask Inspection Technology.- 4.1 Principles of Mask Inspection.- 4.2 Mask Inspection Systems.- 5. Crystal Technology.- 5.1 Overview.- 5.2 Impurities in Si Crystals.- 5.3 Wafer Bow and Warpage.- 5.4 Thermally Induced Microdefects.- 5.5 Epitaxial Growth.- 6. Process Technology.- 6.1 Dry Etching.- 6.2 Beam Annealing.- 6.3 Thin-Film Deposition Techniques.- 6.4 Metallization.- 6.5 Evaluation of Gate Oxide Film.- 6.6 Super Clean Environment.- 7. Fundamentals of Test and Evaluation.- 7.1 Testing and Evaluation of the Device Design.- 7.2 Device Analysis and Evaluation.- 7.3 Device Testing.- 8. Basic Device Technology.- 8.1 Background.- 8.2 Limitations for Miniaturization.- 8.3 Prediction of Device Performance Advancements.- 8.4 Examples of Device Structure.- 8.5 Device Structure.- References.
